Highly integrated step-down solution in a QFN package with high density and efficiency and 30% better thermal dissipation compared to competitor solutions.
Industry�s smallest integrated 600-mA power solution at 6.7 mm2, providing 90 mA/mm2. The device combines all external components in TI�s new MicroSiP� package with a 1-mm height.
Texas Instruments HiRel has introduced a portfolio of standard catalog semiconductor devices for extreme temperature operation. These components form a complete signal chain roadmap for High Temperature industrial and aerospace applications.
To support the demanding nature of space applications, TI HiRel has introduced MILPRF-38535 radiationtolerant products to our extensive qualified manufacturer listing (QML) Class V family.
The ADS1298ECGFE-PDK is a tool for quick evaluation of TI's new ADS1298 analog front end for electrocardiogram (ECG) applications. This video demonstrates the steps necessary to get started using this evaluation module.
In this video Mike Heimlich demonstrates AWR Connected's link to Mentor. AWR Connected for Mentor Graphics Expedition achieves concurrency between RF/microwave design, electromagnetic (EM) analysis, and circuit simulation with PCB library management, digital/analog mixed signal (AMS) implementation, and manufacturing verification and preparation - seamlessly within the AWR Design Environment�.
In this video Mike Heimlich, the Product Marketing Manager of AWR, shows briefly AWR Connected concept for Mentor. AWR Connected for Mentor Graphics Expedition achieves concurrency between RF/microwave design, electromagnetic (EM) analysis, and circuit simulation with PCB library management, digital/analog mixed signal (AMS) implementation, and manufacturing verification and preparation - seamlessly within the AWR Design Environment�.
In this video Mike Heimlich shows AXIEM new feature: De-embedding Ports. AWR's AXIEM electromagnetic (EM) software is an industry first to deliver EM analysis as a true upfront design technology. The AXIEM product was developed specifically for three-dimensional (3D) planar applications such as RF PCBs and modules, LTCC, MMIC, and RFIC designs.
In this video Mike Heimlich shows AXIEM new feature: De-embedding Ports. AWR's AXIEM electromagnetic (EM) software is an industry first to deliver EM analysis as a true upfront design technology. The AXIEM product was developed specifically for three-dimensional (3D) planar applications such as RF PCBs and modules, LTCC, MMIC, and RFIC designs.
Wolfgang Kemper and Vinod Mukundagiri briefly demonstrate what happens when laptops try to communicate via Firewire when a TPD4S1394 is not designed in.